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| SERIAL |
ITEM
|
TECHNICAL
DATA |
| 1 |
Layers |
2－30(layers) |
| 2 |
Max Board Size |
18" x 24" |
| 3 |
Min Board Thickness |
4（layers）16mil |
| 6（layers）32mil |
| 8（layers）40mil |
| 10（layers）48mil |
| 4 |
Min Line Width |
4mil |
| 5 |
Min Line Space |
4mil |
| 6 |
Min
Hole Size |
8mil |
| 7 |
PTH
Wall Thickness |
0.8mil |
| 8 |
PTH
dia tolerance |
±2mil |
| 9 |
NPTH
hole dia tolerance |
±1mil |
| 10 |
Hole
Position Deviation |
±2mil |
| 11 |
Outline
Tolerance |
±4mil |
| 12 |
S/M Pitch |
3mil |
| 13 |
Insulation
Resistance |
1E+12Ω(Normal) |
| 14 |
Aspect ratio |
10:1 |
| 15 |
Thermal
Shock |
3x10Sec@288
℃ |
| 16 |
Warp and Twist |
≤0.7% |
| 17 |
Electric Strength |
＞1.3KV/mm |
| 18 |
Peel Strength |
1.4N/mm |
| 19 |
Solder Mask Abrasion |
≥6H |
| 20 |
Flammability |
94V-0 |
| 21 |
Impedance Control |
±5% |
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