mobile phone module
Craft show
| Layers | 3L |
| Board thickness | 0.17±0.03mm |
| Material | E1210D250NM |
| Line width / space | 0.05±0.015/0.032mm |
| Minimum aperture | 0.075mm |
| Surface treatment | ENIG |
FPC use polyimide substrates for 3D dynamic wiring, featuring ultra-thin profiles (<0.2mm), >10,000 bend cycles, and 50μm-level dense routing. With high vibration/temperature resistance, they enable space-saving solutions for foldable phones, aerospace wiring, and medical endoscopes. SDG, as an industry leader, specializes in high-precision FPCs and rigid-flex boards, supplying core components to global brands in consumer electronics, automotive, and medical sectors.
Craft show
| Layers | 3L |
| Board thickness | 0.17±0.03mm |
| Material | E1210D250NM |
| Line width / space | 0.05±0.015/0.032mm |
| Minimum aperture | 0.075mm |
| Surface treatment | ENIG |
Craft show
| Layers | 2L |
| Board thickness | ≤0.15mm |
| Material | MB12-25-12UEG |
| Line width / space | 0.05±0.020/0.033mm |
| Minimum aperture | 0.05mm |
| Surface treatment | ENIG |
Craft show
| Layers | 2L |
| Board thickness | 0.12mm |
| Material | MB12-25-12CEG |
| Line width / space | 0.06/0.06mm |
| Minimum aperture | 0.1mm |
| Surface treatment | Gilt |
Shenzhen FPC plant
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